коефицијент топлотног ширења

коефицијент топлотног ширења

The measurement (in /°C or ppm/°C) of the rate at which a given material will expand or contract as the temperature changes. Where two materials with different rates of thermal expansion are joined, expansion or contraction will strain the bond interface between them. Continual straining of that bond could result in separation.

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Industry/Domain: Semiconductors
Category: Semiconductor quality
Company: National Semiconductor
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